Tech article
The iPhone Duo’s cooling system hides a clever trick inside its hinge - 9to5Mac
Publisher description: While a folding iPhone posed a new challenge for Apple’s thermal engineering team, they came up with a creative way to leverage the device’s hinge to their advantage.
NewsAPI | Oct 13, 2026 | Marcus Mendes
Automated excerpt
PCMag recently sat down with Dan Murray, Apple’s vice president of silicon engineering, and Banafsheh Barabadi, the company’s senior manager of thermal product design, to discuss the architecture of the A20 Pro chip. The new SoC, which powers the iPhone 18 Pro, iPhone 18 Pro Max, and iPhone Duo, is Apple’s first iPhone chip built on a 2 nm process, following the technology’s debut with the M6 chip in the Mac mini in August. That includes what Apple calls “metal over foam,” a material that iFixit also examined during its recent teardown of the iPhone 18 Pro.
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